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rf hardened, ultralow noise microphone with bottom port and analog output data sheet ADMP510 rev. 0 document feedback information furnished by analog devices is believed to be accurate and reliable. however, no responsibility is assumed by analog devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. specifications subject to change without notice. no license is granted by implication or otherwise under any patent or patent rights of analog devices. tradema rks and registered trademarks are the property of their respective owners. one technology way, p.o. box 9106, norwood, ma 02062 - 9106, u.s.a. tel: 781.329.4700 ? 2013 analog devices, inc. all rights reserved. technical support www.analog.com features tiny , 3.35 mm 2.5 mm 0.98 mm surface - mount package noninverted signal output omnidirectional response h igh snr of 6 5 dba s ensitivity of ? 38 dbv sensitivity tolerance of 2 db extended frequency response from 6 0 hz to 20 khz enhanced radio freq uency ( rf ) performance a coustic overload point of 12 4 db spl low current consumption of 18 0 a single - ended analog output high ps r of ? 78 db v compatible with sn/ pb and pb - free solder processes rohs/weee compliant applications smartphones and feature phone s tablet computers teleconferencing systems digital still and video cameras bluetooth h eadsets notebook pcs security and surveillance functional block dia gram output amplifier ADMP510 power v dd gnd output 1 1532-001 figure 1. 1 1532-002 figure 2 . isometric views of th e microphone package general description the ADMP510 1 is a n rf hardened, analog output , bottom - ported , omnidirectional mems microphone with high performance, ultralow noise, and low power . the ADMP510 consists of a mems microphone element, an impedance converter, and an output amplifier. the ADMP510 sensitivity specification makes it an excellent choice for both near - field and far - field applications. the ADMP510 is pin compatible with the admp504 microphon e. the ADMP510 has a very high signal - to - noise ratio ( snr ) and extended wideband frequency response , resulting in natural sound with high intelligibility. low current consumption enable s long battery life for portable applications. the ADMP510 is available in an ultraminiature 3.35 mm 2.5 mm 0.98 mm surface - mount package. it is reflow solder compatible with no sensitivity degradat ion. 1 protected by u.s. patents 7,449,356; 7,825,484; 7,885,423; and 7,961,897. other patents are pending.
ADMP510 data sheet rev. 0 | page 2 of 12 table of contents features .............................................................................................. 1 applications ....................................................................................... 1 functional block diagram .............................................................. 1 general description ......................................................................... 1 revision history ............................................................................... 2 specifications ..................................................................................... 3 absolute maximum ratings ............................................................ 4 esd caution .................................................................................. 4 soldering profile ........................................................................... 4 pin configuration and function descriptions ............................. 5 typical performance characteristics ............................................. 6 applications information .................................................................7 interfacing with analog devices cod ecs ...................................7 supporting documents ................................................................7 pcb design and land pattern layout ............................................8 handling instructions .......................................................................9 pick - and - place equipment ..........................................................9 reflow solder .................................................................................9 board wash ....................................................................................9 outline dimensions ....................................................................... 10 ordering guide .......................................................................... 10 revision hi story 7 /13 rev ision 0: i nitial versi on
data sheet ADMP510 rev. 0 | page 3 of 12 specifications t a = 25 c, v dd = 1.8 v , unless otherwise noted. all minimum and maximum specifications are guaranteed. typical specifications are not guaranteed. table 1 . parameter symbol test conditions/comments min typ max unit performance directionality omni output polarity noninverted sensitivity 1 khz, 94 db sound pressure level (spl) ? 40 ? 38 ? 36 db v signal -to - noise ratio snr 20 hz to 20 khz, a - weighted 65 dba equivalent input noise ein 20 hz to 20 khz, a - weighted 29 dba spl dynamic range derived from ein and maximum acoustic input 91 db frequency response 1 low frequency ?3 db point 6 0 hz high frequency ?3 db point >20 khz total harmonic distortion thd 105 db spl 0.2 1 % power supply rejection psr 217 hz, 100 mv p - p s quar e wave super - imposed on v dd = 1.8 v (a - weighted) ? 78 db v power supply rejection ratio psr r 1 khz, 100 mv p - p sine wave superimposed on v dd = 1.8 v ? 55 db acoustic overload point 10% thd 1 24 db spl power supply supply voltage v dd 1. 5 3.63 v supply current i s v dd = 1.8 v 180 220 a v dd = 3.3 v 210 250 a output characteristics output impedance z out 350 ? output dc offset 0. 7 v maximum output voltage 124 db spl input 0.398 v rms noise floor 20 hz to 20 khz, a - weighted , rms ? 103 db v 1 see figure 5 and figure 6 .
ADMP510 data sheet rev. 0 | page 4 of 12 a bsolute m aximum r atings table 2 . parameter ra ting supply voltage ?0.3 v to + 3.6 3 v sound pressure level (spl) 160 db mechanical shock 1 0,000 g vibration per mil - std -883 m ethod 2007, test condition b temperature range ?40c to +85c stresses above those listed under absolute maximum ratings may cause permanent damage to the device. this is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. exposure to absolute maximum rat ing conditions for extended periods may affect device reliability. esd caution soldering profile t p t l t 25c to peak t s preheat critical zone t l to t p temperature time ramp-down ramp-up t smin t smax t p t l 1 1532-003 figure 3. recommended soldering profile limits table 3 . recommended soldering profile limits profil e feature sn63/pb37 pb - free average ramp rate (t l to t p ) 1.25c/sec max imum 1.25c/sec maximum preheat minimum temperature (t smin ) 100c 1 5 0c maximum temperature (t smax ) 150c 200c time , t smin to t smax ( t s ) 60 sec to 75 sec 60 sec to 75 sec ramp - up rate ( t smax to t l ) 1.25c/sec 1.25c/sec time maintained above liquidous (t l ) 45 sec to 75 sec ~50 sec liquidous temperature ( t l ) 183c 217c peak temperature (t p ) 215c + 3c/?3c 260c +0c/?5c time within 5c of actual peak temperature (t p ) 20 sec to 30 sec 20 sec to 30 sec ramp - down rate 3c/sec maximum 3c/sec maximum time 25c ( t 25c ) to peak temperature 5 minute s maximum 5 minute s maximum
data sheet ADMP510 rev. 0 | page 5 of 12 pin configuration an d f unction descriptions gnd output top view (terminal side down) not to scale ADMP510 2 v dd 1 3 1 1532-004 figure 4. pin configuration table 4 . pin function descriptions pin no. mnemonic description 1 v dd power supply 2 output analog output signal 3 gnd ground
ADMP510 data sheet rev. 0 | page 6 of 12 typical performance cha racteristics 20 15 10 5 ?15 ?10 ?5 0 10 100 10k frequency (hz) normalized amplitude (db) 1k 1 1532-005 figure 5 . frequency response mask 15 ?15 ?10 ?5 0 5 10 10 100 10k frequency (hz) normalized amplitude (db) 1k 1 1532-007 figure 6. typical frequency response (m easured) ?50 ?51 ?52 ?53 ?54 ?55 ?56 ?57 ?58 ?59 ?60 100 10k frequency (hz) psrr (db) 1k 11532-006 figure 7 . typical p ower supply rejection ratio vs. frequency 0.1 10 1 90 130 120 110 100 input (db spl) thd + n (%) 11532-008 figure 8. thd + n vs. input spl 0 ?50 ?45 ?40 ?35 ?30 ?25 ?20 ?15 ?10 ?5 90 100 110 120 130 140 output amplitude (dbv) input amplitude (db spl) 1 1532-009 figure 9. linearity 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 1.0 0.5 time (ms) output (v) 11532-010 120db spl 124db spl 128db spl 132db spl figure 10 . clipping characteristics
data sheet ADMP510 rev. 0 | page 7 of 12 applications informa tion interfacing w ith analog devices c odecs the output of the ADMP510 can be connected to a dedicated codec microphone input (see figure 11 ) or to a high input impedance gain stage (see figure 12 ). a 0.1 f ceramic capacitor placed close to the ADMP510 supply pin i s used for testing and is recom mended to adequately decouple the microphone from noise on the power supply. a dc blocking cap acitor is required at the output of the microphone. this capacitor creates a high - pass filter with a corner frequency at f c = 1/(2 c r ) where r is th e input impedance of the codec. a minimum value of 2.2 f is recommended in figure 11 because the input impedance of the adau1761 / adau1361 can be as low as 2 k at its highest pga gain setting, which results in a high - pass filter corner frequency at about 37 hz. adau1761 or adau1361 ADMP510 gnd output linn linp micbias cm 2.2f minimum 0.1f v dd 1 1532-0 1 1 figure 11 . ADMP510 connected to the adau1761 or adau1361 codec figure 12 shows the ADMP510 connected to an ada4075 - 2 op amp configured as a noninverting preamplifier. gain = (r1 + r2)/r1 ADMP510 gnd output 1f minimum 0.1f 10k? r1 r2 v dd v ref v out v ref ada4075-2 1 1532-012 figure 12 . ADMP510 connected to the ada4075 - 2 op amp supporting documents for additional information, see the following documents . evaluation board user gu ide ug - 325, analog output mems microphone flex evaluation board circuit note cn - 0207, high performance analog mems microphone s simple i nterface to sigmadsp audio codec application notes an - 1003, recommendations for mounting and connecting the analog devices, inc., bottom - ported mems microphones an - 1068, reflow soldering of the mems microphone an - 1112, microphone specifications explained an - 1124, rec ommendations for sealing analog devices, inc., bottom - port mems microphones from dust and liquid ingress an - 1140, microphone array beamforming an - 1165, op amps for mems microphone preamp circuits an - 1181, using a mems microphone in a 2 - wire microphone circuit
ADMP510 data sheet rev. 0 | page 8 of 12 pcb design and land pattern layout lay out the pcb land patte rn for the ADMP510 at a 1:1 ratio to the solder pads on the microphone package (see figure 13 ) . ta ke care to avoid applying solder paste to the sound ho le in the pcb. figure 14 shows a suggested solder paste stencil pattern layout. the diameter of the sound hole in the pcb should be larger than the diameter of the sound port of the microphone . a minimum diameter of 0.5 mm is recommended. ?1.55 ?0.95 1.52 0.90 1.90 1.22 0.68 0.61 0.61 11532-013 figure 13 . suggested pcb land pattern layout 1.22 2 0.8 0.6 0.2 45 typ 1.52mm 1.55/1.05 dia. 0.225 cut width (2) 11532-014 figure 14 . suggested solder paste stencil pattern layout
data sheet ADMP510 rev. 0 | page 9 of 12 handling instruction s pick - and - place equipment the mems micropho ne can be handled using standard pick - and - place and chip shooting equipment. take c are to avoid damage to the mems microphone structure as follows: ? use a standard pickup tool to handle the microphone. because the microphone hole is located on the bottom su rface of the package (see figure 2 ) , the pickup tool can make contact with any part of the top lid surface. ? do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone. ? do not use exc essive force to place the microphone on the pcb . reflow solder for best results, the soldering profile should be in accordance with the recommendations of the manufacturer of the solder paste used to attach the mems microphone to the pcb . it is recommend ed that the solder reflow profile not exceed the limit conditions specified in figure 3 and table 3 . board wash when washing the pcb, ensure that water does not make cont act with the microphone port. do not use b low - off procedures or ultrasonic cleaning.
ADMP510 data sheet rev. 0 | page 10 of 12 outline dimensions 2.575 2.500 2.425 3.425 3.350 3.275 01-29-2013- a top view side view reference corner 1.08 0.98 0.88 2.21 ref 3.06 ref bot t om view 1.08 0.95 dia. 0.25 nom 0.20 min dia. thru hole (sound port) 1.22 bsc 1.25 0.54 ref 0.64 ref 1.55 dia. 1.52 bsc 1.07 ref 0.75 ref 2 1 3 0.90 0.68 (pins 1, 3) 0.20 typ 45 0.30 bsc pin 1 figure 15 . 3- terminal chip array small outline no lead cavity [lga_cav] 3.35 mm 2.5 mm body (ce - 3- 5) dimensions shown in millimeters ordering guide model 1 temperature range package description package option 2 ordering quantity admp5 10 acez - rl ?40c to + 85c 3 - terminal lga_cav , 13 tape and reel ce -3 -5 10,000 admp5 10 acez - rl7 ?40c to +85c 3 - terminal l ga_cav, 7 tape and reel ce -3 -5 1,000 eva l - admp5 10 z - flex flex ible evaluation board 1 z = rohs compliant part. 2 this package option is halide free .
data sheet ADMP510 rev. 0 | page 11 of 12 notes
ADMP510 data sheet rev. 0 | page 12 of 12 notes ? 2013 analog devices, inc. all rights reserved. trademarks and registered trademarks are the property of their respective owners. d11532 - 0- 7/13(0)

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